Assessment of the Trench IGBT reliability: low temperature experimental characterization

نویسندگان

  • Stephane Azzopardi
  • A. Benmansour
  • M. Ishiko
  • Eric Woirgard
چکیده

The purpose of this study is an assessment of the Trench IGBT reliability at low temperature under static and dynamic operations by the aim of intensive measurements. The analysis of the Trench IGBT behaviour in these conditions is dedicated to the HEV applications. One question can be raised in case of the use of HEV in countries where during winter the temperature drops down -50°C or less: are Trench IGBT strongly affected by the low temperature environment? In this paper, we present experimental results under various test conditions (temperature, gate resistance, voltage and current) to give an understanding of the device behaviour by focusing on the device current and voltage waveforms and the power losses. * Corresponding author. [email protected] Tel: +33 (0) 5 400

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions

Two extreme configurations under short circuit conditions leading to the punch through Trench IGBT failure under the effect of the temperature and the gate resistance have been studied. By analyzing internal physical parameters, it was highlighted that the elevation of the temperature causes an acceleration of the failure which is due to a thermal runaway phenomenon, whereas the influence of th...

متن کامل

On the reliability assessment of trench fieldstop IGBT under atmospheric neutron spectrum

In the early 1990s, active power devices have been shown to be susceptible to radiation-induced failures. Many studies have been focused on cosmic ray-induced power device failures, including even IGBT failures. Till the end of the 1990s, IGBT technologies were susceptible to static or dynamic latch-up, which are respectively occurring in their forward conduction or switching mode. From then on...

متن کامل

Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature

Silicon dice soldered in power assemblies have to withstand simultaneously electrical, thermal and mechanical stress. Mechanical stress is an important issue because it will directly impact on both the device behaviour and power modules reliability. This paper focuses on the electro-mechanical static characterization of a planar gate IGBT by the help of experiments at controlled temperatures. A...

متن کامل

1800A/3.3kV IGBT Module using Advanced Trench HiGT Structure and Module Design Optimization

1800A/3.3kV IGBT module with the highest current rating was developed. Advanced Trench HiGT structure was used to achieve low loss characteristics. Module electrical and thermal characteristic were optimized in order to reduce thermal resistance and parasitic inductance. The current ratings of new IGBT module can be increased by 20% from the conventional product type.

متن کامل

A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation

A systematic methodology is developed in order to clarify the punch through Trench Insulated Gate Bipolar Transistor (T-IGBT) failure mechanisms which can occur under extreme operating conditions such as short circuit and clamped inductive switching. By considering a 2D dimensional physically based device simulation, and by analyzing some T-IGBT physical parameters, it is possible to identify i...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • Microelectronics Reliability

دوره 45  شماره 

صفحات  -

تاریخ انتشار 2005